Test Manager
Description:
This is a senior management position. The candidate will be managing a group of approximately 8-10 talented test engineers in research, developing, prototyping, and releasing product into production for Emerson Embedded Computing platforms. The personnel related responsibilities include recruiting and forming a team, and helping team members develop and grow in their career path, and perform. day to day coaching/support duties. The day to day duties include synchronizing with project managers to understand the project requirements and assigning the appropriate resources to the project team. Product related responsibilities include defining and developing projects from specification to production, working with design engineers and system architects to insure proper features trade-off, and working with product marketing groups to ensure proper technology alignment with future product needs. The candidate should be able to drive the adaption of new technologies and use the new technologies in product testing to improve test automation and increase test coverage.
Qualification:
The candidate should possess a Bachelor's or Master degree in Electrical Engineering or related field with at least 7 years of Design-engineering experience plus at least 5 years industry related management experience. Additional qualifications include:
· Must have at least 7 years engineer plus 5 years management experiences in blade server, industry motherboard or any other embedded computing devices product development
· Familiar with product development life cycle in a R & D organization and understand product development process.
· High-PerformanceBlade design knowledge and experience in the area of schematic capture, synthesis, placement and route, signal integrity, regulatory compliance (EMC/EMI, ESD, safety, shock & vibration) and transfer into volume production are required. Recent Design experience should ideally be based on AdvancedTCA/microTCA(PICMG) industry standard including knowledge in Design-for-test and Design-for-Manufacturing
· A solid understanding of complex high-density and high-speed PCB design and expertise with Intel architectures and related I/O interfaces (PCIe, SAS/SATA, DDR2-3, Ethernet 1/10G) is required
· Experience in thermal analysis (based on Icepack/Flowtherm), air flow analysis, and mechanical interface such as connectors, faceplates, handles, and heat sinks
· Strong leadership, analytical, and problem solving skills are required.
· Good verbal and written communication skills in both English and Chinese
· Ability to provide work and resource estimation, feasibility studies, mitigate risks and meet cost, schedule, and quality commitments
· Strong work ethic; coach/mentor/develop engineers and staffs with positive attitude
· Experience in customer, marketing, and factory interfaces
Additional qualification that is helpful:
· A working knowledge of UNIX OS is a plus
· Experience in dealing with Rational toolset, Clearcase or Clearquest
· Provide three references
